MITSUI SEIKI'S 3RD GENERATION OF VERTEX 55X MACHINE

Visitors to Mitsui Seiki’s booth #338700 at IMTS 2024 September 9-14 at McCormick Place, Chicago, IL can view the ultra-high precision Vertex 55X III, a machine capable of performing multiple functions making it ideally suited for aerospace and mold and die work. The Vertex 55X III uses a Fanuc 31iM-B5 control, making the machine capable of processing tasks such as contour milling, profiling, boring, tapping, and reaming. The 55X III line is designed for both versatility and precision. Machines can be adapted to integrate seamlessly into any machining cell. To demonstrate this, the 55X III at IMTS will showcase a field retrofittable pallet system with shared tool capacity. The system will have a total of 12 pallets and 140 tools. The Vertex 55X III line includes several configurations, based on table sizes and types from 3.9” (100mm) to 19.7” (500mm) diameter. With feed rates as small as 0.004”/min (0.1mm/min), and minimum resolution of 0.0000004” (0.0001mm) on the X, Y, and Z axes, parts with ultra precise requirements can be machined with ease.  Mitsui Seiki offers 30,000rpm, 25,000rpm and 15,000rpm spindle options with this machine. “The Vertex line of machines delivers unmatched versatility and precision,” states Daniel Cleary, President of Mitsui Seiki USA, Inc. “We are excited to demonstrate to attendees how integrating a pallet system can seamlessly introduce ultra-precise machining into a continuous production environment.”